Cold mounting Consumables for perfect metallographic sample preparation

The term cold mounting covers all mounting methods that do not require the use of a hot mounting press. To create a optimal cold-mounted specimen, consider the following:

The specimen must not be affected or corroded by the resin selected for cold mounting
The specimen must be able to withstand the peak temperature of the mounting system.
To prevent gap formation, the specimen surface must be free of dust and grease before mounting, so that the specimen can be well wetted with the mounting medium.

QPREP cold mounting resins are available on methyl methacrylate or MMA-free and epoxy based. Acrylate or MMA-free based cold mounting resins are characterized by good removal rate, short curing times and good chemical resistance. Epoxy resins are used for mounting of porous and temperaturesensitive materials. Furthermore, they are used when the lowest possible gap formation is intended.

KEM 15 plus

QPREP KEM 15 PLUS is a universally applicable two-component cold mounting material based on a modified polyester resin. Due to its very low shrinkage, it is particularly suitable for boundary layer investigations.

Product Advantages

Very low shrinkage
High edge retention
Good chemical resistance
Good mechanical machinability
Easy dosage with enclosed measuring spoon
Curing temperature : ca. 85-100 °C
Curing time: ca. 25 min
Hardness (Shore D): 85
Removal rate: Very low

Recommended applications

Edge examination
Mounting of medium-hard to hard materials
Curing by means of overpressure with pressure equipment possible, to minimize porosity and increase edge retention

Order Data

KEM 20

QPREP KEM 20 is a universally applicable two-component cold mounting material based on a methyl methacrylate resin compound. Transparent mountings can be realized when curing under overpressure.

Product Advantages

Feasibility of transparent mountings by means of pressure equipment
Good chemical resistance
Good mechanical machinability
Easy dosage with enclosed measuring spoon
Curing temperature : ca. 100-120 °C
Curing time: ca. 15 min
Hardness (Shore D): 84
Removal rate: medium

Recommended applications

Target preparations
Mounting of soft to medium-hard materials

Order Data

KEM 30

QPREP KEM 30 is a universal two-component cold mounting resin based on a methyl methacrylate resin compound. It is a fast curing resin, which is particularly suitable for high sample throughput.
Product Advantages

Semi-transparent
Good chemical resistance
Good mechanical machinability
Easy dosage with enclosed measuring spoon
Curing temperature : ca. 95-110 °C
Curing time: ca. 5 min
Hardness (Shore D): 85
Removal rate: medium

Recommended applications

Routine testing with high sample throughput
Mounting of soft to medium-hard materials
Curing by means of overpressure with pressure equipment possible, to minimize porosity

Order Data

KEM 35

QPREP KEM 35 is a universally applicable two-component cold mounting material based on a methyl methacrylate resin compound. Due to its very low shrinkage and hardness, it is particularly suitable for edge examination on materials with higher hardness.
Product Advantages

Very low shrinkage
High edge retention
Very good mechanical machinability
Easy dosage with enclosed measuring spoon
Curing temperature : ca. 85-110 °C
Curing time: ca. 12 min
Hardness (Shore D): 87
Removal rate: Very low

Recommended applications

Edge examination
Mounting of hard materials
Curing by means of overpressure with pressure equipment possible, to minimize porosity and increase edge retention

Order Data

KEM 60

QPREP KEM 60 is a universally applicable, mineral-filled, MMA-free two-component cold mounting resin. It is characterized by short curing time and good mechanical machinability.

Product Advantages

Free of MMA
Good chemical resistance
Good mechanical machinability
Curing temperature : ca. 95-110 °C
Curing time: ca. 10 min
Hardness (Shore D): 85
Removal rate: low

Recommended applications

Routine mountings
Very wide range of application
Curing by means of overpressure with pressure equipment possible, to minimize porosity

Order Data

QPREP SEM 5000

QPREP SEM 5000 is an electrically conductive cold mounting material based on a modified Methyl methacrylate compound. It is suitable for SEM examinations and electrolytic polishing.

Product Advantages

Electroconductive
Contains copper particles
Curing temperature : 85 - 110 °C
Curing time: 10 min
Hardness (Shore D): 91
Removal rate: Very low

Recommended applications

Scanning electron microscopy
Electrolytic polishing

Order Data

QPOX 90

QPREP QPOX 90 is a transparent two-component cold mounting material based on an epoxy resin. Due to its good flowability, it is well suited for the pre-potting of specimens with filigree and complex geometries.

Product Advantages

Good transparency
Very low gap formation
Low viscosity
Suitable for vacuum infiltration
Curing temperature : RT to approx. 50 °C
Curing time: 16 - 24 hours
Hardness (Shore D): 79
Removal rate: high

Recommended applications

Routine mountings
Applicable for a wide range of materials
Target preparations
Infiltration of porous materials
Pre-potting of assembled printed circuit boards to fix electronic components prior to cutting.
Mounting of low hardness material

Order Data

QPOX 92

QPREP QPOX 92 is a highly transparent two-component cold mounting material on epoxy resin. It is very well suited for specimens with filigree and complex geometries. In addition, QPOX 92 is particularly recommended for mounting materials with temperature sensitive surfaces and for target preparations.

Product Advantages

Very good transparency
Very low gap formation
Low viscosity
Suitable for vacuum infiltration
Curing temperature : RT to approx. 35 °C
Curing time: 12 - 13 hours (50% faster than QPOX 90)
Hardness (Shore D): 81
Removal rate: medium

Recommended applications

Routine mountings
Applicable for a wide range of materials
Target preparations of defects in coating surfaces
Infiltration of porous materials
Pre-potting of assembled printed circuit boards to fix electronic components prior to cutting.
Mounting of low hardness material

Order Data

NEW: Qpox 94

Qpox 94 is a low-viscosity and transparent two-component epoxy-based cold mounting resin, ideal for samples with delicate and complex geometries. It is particularly suitable for sensitive and porous surfaces as well as target preparations. With a curing time of about 9 hours Qpox 94 allows transparent and gap-free mounting and preparation on the same day.

Product Advantages

Excellent adhesion and very low gap formation
Very good transparency
Low-bubble mountings
Low viscosity
Suitable for vacuum infiltration
Curing temperature: RT up to 45°C (Tmax = 100 to 140°C)
Curing time: 9 h at RT (25% faster than Qpox 92), 3 h at 45°C
Hardness (Shore D): 80
Removal rate: High

Recommended applications

Low-gap and transparent preparations on the same day
Can be used for a wide range of materials
For vacuum infiltration of porous materials and material surfaces, such as metal foams, porous ceramic support material or samples with corrosion layers
Mountings and target preparations of assembled PCBs
For filigree and sensitive specimens of more complex geometries and low-hardness workpieces

Order Data

Epoxy resins comparison chart

Vacuum infiltration and pressure device

When cold mounting porous specimens it is purposeful to infiltrate them under vacuum, with a low viscosity mounting medium (epoxy resins). The QPREP infiltration device offers a solution for mounting under vacuum.

For transparent cold mounting using methyl methacrylate, these must be cured in a pressure device under positive pressure (2 - 2.5 bar). This increases the boiling point of the mounting material and suppresses the formation of gas bubbles during polymerization. The QPREP Pressure unit is best suited for this purpose.

Product Advantages

Infiltration of porous materials
Reinforcement of fragile materials
Clear/transparent mounting possible with methyl methacrylate

Recommended applications

Infiltration device for mounting porous samples with epoxy resin (Qpox 90 / 92 / 94)
Pressure device for mounting with methyl methacrylate (KEM 15, 20, 30, 35, 60 and QPREP SEM 5000)

Order Data

Cold mounting moulds

Choosing a cold mounting mould of the correct size and suitable material the result of the mounting can be optimized. QPREP offers a variety of reusable and chemically resistant moulds of different sizes and materials for this purpose.

Silicone rubber, round or rectangular, beveled edge

Flexibility of the material enables easy demoulding after curing
Thick-walled mould, therefore, not recommended for light curing
Without removable base

Polypropylene, round

Semi-transparent, therefore suitable for light curing
With removable base for easy demoulding after curing

Polyethylene, round

Opaque, therefore, not recommended for light curing
With removable base for easy demoulding after curing

PTFE, beveled edge, round

Long period of usage
High strength, for long shape retention
Opaque, therefore not recommended for light curing
With removable base for easy demoulding after curing

Order Data

Accessories & tools for cold and UV mounting

The mixing of the different resin components as well as the exact positioning of your specimens influence the quality of your mounting. Therefore, QPREP supports with a wide range of tools and accessories for cold mounting. Mixing of the resin components, fixing and correct positioning of the samples in the cold mounting moulds can thus be realized reliably and safely.

Accessories

Mixing beakers and spatulas
Mounting utilities
Dosing spoons
Steel- and plastic clips

Accessories & tools for cold and UV mounting

Perfect mounting – Instruments by QATM

Mounting is more reliable, safer and more efficient when performed with the right equipment: Knowledge, exercising care and the right choice of consumables and equipment are crucial.

Discover our mounting devices

Knowledge Base

If you would like to learn more about the different procedures, please visit our extensive Knowledge Base.

Our Knowledge Base article about mounting includes:

Advantages of materialographic mounting
The difference between cold and hot mounting
How to avoid gap formation between mounting compound and sample

Knowledge Base

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QATM Products & Contact

QATM offers a wide range of innovative machines for metallographic sample preparation. Accompanying QATM consumables are thoroughly tested and selected for perfect interaction with our machines. Contact us for a consultation, quote or to talk to one of our dedicated application specialists!

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